Group Presentation July 2018 to June 2022


    La Jolla Immunology conference
  1. Oncolytic Adenovirus with Liposomes Encapsulation Induces Anticancer Activity in a CAR-Deficient Tumor Model. Tao Dong A.C. Kummel, University of California at San Diego

  2. Development of Adenovirus Containing Liposomes Produced by Extrusion vs Homogenization: A Comparison for Scale-up Purposes. Jaimin R. Shah A.C. Kummel, University of California at San Diego

  3. Liposome Encapsulation of Adenoviruses Protects against Pre-Existing Humoral Response. Abraham T. Phung A.C. Kummel, University of California at San Diego


    4. American Vacuum Society National Meeting AVS Oct 21-26, 2018 (Long Beach CA) -4 contributed talks + 1 poster

  4. Aluminum Gettering Gate for Improving Defect Density in SiGe MOSCAP Devices, (poster) Emily Thomson, M. Kavrik, A.C. Kummel, University of California at San Diego

  5. Surface Free Energy and Interfacial Strain in HfO2 and HZO Ferroelectric Formation (talk), Andrew Kummel, E. Chagarov, M. Kavrik, University of California at San Diego; M. Katz, N. Sanford, A. Davydov, National Institute of Standards and Technology (NIST); M. Lee, National Taiwan University

  6. A Dry NF3/NH3 Plasma Clean for Removing Si Native Oxide and Leaving a Smooth Si Surface (talk),, Christopher Ahles, J.Y. Choi, University of California, San Diego; A.C. Kummel, University of California at San Diego

  7. TiNx and TaNx Films via Low-T Thermal ALD using Anhydrous N2H4, (talk), Steven Wolf, M. Breeden, M. Kavrik, University of California at San Diego; D. Alvarez, J. Spiegelman, RASIRC; M. Naik, Applied Materials; A.C. Kummel, University of California at San Diego

  8. TuA12 Investigation of Localized Electronic structures of PbSe Quantum Dot Superlattice on a Highly Oriented Pyrolytic Graphite (HOPG), (talk), Il Jo Kwak, S. Ueda, University of California at San Diego; A. Abelson, C. Qian, M. Law, University of California, Irvine; A.C. Kummel, University of California at San Diego


    9. University of Washington, Pullman -Departmental Seminar, Aug 20, 2018

  9. Subnanometer Engineering of Interfaces in Low Power Electronics – Andrew C Kummel, Mahmut Kavrik, Mike Breeden, Steven Wolf, Jun Hung Park, Evgueni Chagarov, UCSD

    10. Wayne State -Departmental Seminar Sept 6, 2018
  10. Subnanometer Engineering of Interfaces in Low Power Electronics – Andrew C Kummel, Mahmut Kavrik, Mike Breeden, Steven Wolf, Jun Hung Park, Evgueni Chagarov, UCSD

    11. Electrochemical Society Oct 1-4, 2018 (Cancun Mexico) 3 invited talks
  11. Surface Free Energy and Interfacial Strain in HfO2 and HZO Ferroelectric Formation – (invited) E. Chagarov, M. Kavrik (University of California, San Diego) (invited

  12. Low Temperature Thermal ALD TiNx and TaNx Films from Anhydrous N2H4 (invited) – S. Wolf, M. Breeden, M. Kavrik, J. H. Park (University of California, San Diego), D. Alvarez Jr., R. Holmes (RASIRC), J. Spiegelman (Rasirc), and A. C. Kummel (University of California, San Diego)

  13. Engineering Low Defect Density Siox Interfaces on SiGe (invited) – M. Kavrik, E. Thomson (University of California, San Diego), K. Tang (Stanford University), S. T. Ueda (University of California, San Diego), V. Hou, C. Y. Lee, Y. C. Liang (TSMC, Hsinchu, Taiwam), T. Aoki (University of California Irvine), M. Kim (The University of Texas at Dallas), B. Fruhberger (CALIT2, University of San Diego), Y. Taur (University of California, San Diego), P. C. McIntyre (Stanford University), and A. C. Kummel (University of California, San Diego)


    14. Morgan Stanley Investment Conference Oct 29, 2018 (San Diego, CA) Invited Talk
  14. Trends and Science in Immuno-Oncology Andrew Kummel


    15. Semiconductor Interface Specialist Conference, SISC, Dec 5-8 2018 (San Diego, CA) (3 talks + 3 posters)
  15. Hyper-Selective Co Metal ALD on Cu and Pt Without Passivation (Talk), S. Wolf, M. Breeden, S. Ueda, A. C. Kummel, UCSD

  16. Selective Etching of Native Silicon Oxide and Flowable SiO2 in Preference to Silicon, Thermal Silicon Oxide and Silicon Nitride,(talk) C. F. Ahles, J. Y. Cho , R. Hung, N. Ki , S. Nemani, and A. C. Kummel, UCSD, Applied Materials

  17. Self-Assembled Monolayers (SAMs) for Hyperselective Silicide, Metal, and Interconnect Diffusion Barrier (poster), M. Breeden, J. Choi, S. Wolf, C. F. Ahles, and A. C. Kummel, UCSD

  18. Formation of Electronically And Chemically Passive Termination on PbSe Quantum Dot Superlattices, (poster) S. T. Ueda, I. Kwak, S. Wolf, M. Breeden, A. Abelson , C. Qian, M. Law, and A. C. Kummel , UCSD, UC Irvine

  19. Hydrophilic Crystalline Nanoparticles Based Ultrasensitive MRI Contrast Agents (poster), J. Wang, J. Flores, S. L. Blair, W. C. Trogler, and A. C. Kummel, UCSD

  20. Selective surface oxidation with periodic ozone dosing into HfO2 on SiGe for SiOx interface (talk), M. S. Kavrik, V. Hou, E. Rotenberg, A. Bostwick, K. Tang, Y. Taur, P. C. McIntyre, and A. C. Kummel, UCSD, TSMC, Taiwan, Lawrence Berkeley Laboratory, Stanford U


    21. Very Large Scale Integration Conference VLSI-TSA April 22-25 2019 (Hsinchu, Taiwan) 1 contributed talk + 2 posters
  21. Selective Etching of Native Silicon Oxide in Preference to Silicon Oxide and Silicon (poster) C. Ahles, J. Choi, R. Huong, N. Kim, S. Nemani, and A. Kummel

  22. Selective Atomic Layer Deposition of TiO2 (poster) C. Ahles, J. Choi, K. Wong, S. Nemani, and A. Kummel

  23. Hyper-Selective Co Metal ALD on Metals vs. SiO2 without Passivation, (talk) S. Wolf, M. Breeden, S. Ueda and A. Kummel, "


    24. TSMC (Taiwan Semiconductor Manufacturing Comporation) April 26, 2019 (Hsinchu Taiwan) Invited Seminar
  24. Selective ALD for Interconnect Applications A. C. Kummel


    25. Morgan Stanley Investment Conference- May 9, 2019 (Scottsdale AZ) Invited Talk
  25. Trends and Science in Immuno-Oncology – Andrew Kummel


    26. Raytheon Corporation Invited Seminar , June 11, 2019 (Tustin, Az) - Invited Talk
  26. Atomic Layer Deposition for Next Generation Semiconductor Electronics – Andrew Kummel, Steven Wolf, Mike Breeden, Ashay Anurag, Jong Choi, Chris Ahles, Scott Ueda, Aaron Mcleod


    27. INFOS Conferences July 1-3, 2019 (Cambridge UK) 2 contributed talks + 1 poster
  27. Selective Atomic Layer Deposition of TiO2, (talk)C. Ahles, J. Choi, K. Wong, S. Nemani and A. Kummel, UC San Diego, USA and Applied Materials

  28. Low Defect Interfaces on SiGe by Imperfect ALD. (talk) M. S. Kavrik, E. Chagarov, and A. Kummel, UC San Diego,

  29. Surface Free Energy and Interface Strain in HfO2 and HfZrO2 Ferroelectric Formation - A C. Kummel, E. Chagarov, M. Kavrik, M.B. Katz, N. A. Sanford, A. Davydov2 M. H. Lee UC San Diego, CA, USA; NTNU, Taipei, Taiwan,


    30. AMSL Corporation July 25th, 2019 (San Diego, CA) Invited Seminar
  30. ALD for Corrosion Inhibition – Andrew Kummel


    31. HK Hynix Corporation July 31, 2019 (Seoul, South Korea) Invited Seminar<
  31. Novel ALD of Metals, Silicides, Barriers, and Heat Spreaders – Andrew Kummel


    32. Samsung Corporation Aug 2, 2019 (Seoul, South Korea) Invited Seminar
  32. Novel ALD of Metals, Silicides, Barriers, and Heat – Andrew Kummel


    33. Global Foundries Sept 23, 2019 (Albany NY) Invited Seminar
  33. DFTMD of Amorphous Oxide-GaN Interfaces Evgueni Chagarov and Andrew Kummel


    34. International Electron Device Meeting (IEMD) Dec 7-9 2019 (San Francisco) 1 contributed talk
  34. A Novel Ferroelectric Superlattice Based Multi-Level Cell Non-Volatile Memory K. Ni, J. Smith, A. C. Kummel, and S. Datta,


    35. Semiconductor Interface Specialist Conference, SISC, Dec 11-14 2019 (San Diego) 2 contributed talks, 5 posters
  35. Selectivity Comparison of Co & Ru Metal ALD on Cu, Pt, and SiO2, (talk) M. Breeden, S. Wolf, J. Choi, S. Ueda, and A. C. Kummel, UCSD

  36. Atomic and Electronic structure of Quantum Dot Super Lattice, (poster)M. S. Kavrik , W. Ko , J. A. Hachtel , C. Qian , A. Abelson , H. Kashyap, A. Li, J. Idrobo, M. Law , and A. C. Kummel, UCSD, Oak Ridge National Laboratory, UC Irvine

  37. Processes for Low Temperature Crystalline Aluminum Nitride Atomic Layer Deposition (poster) A. McLeod, S. T. Ueda, V. Wang, and A. C. Kummel, UCSD

  38. Selective Water-Free Deposition of TiO2, C. Ahles , J. Choi , Y. Cho , K. Wong, S. Nemani, and A. C. Kummel, UCSD, Applied Materials

  39. Vapor Phase Passivation for Selective ALD and CVD of Metals, Metal Oxides, and Metal Silicides (poster), A. Anurag, M. Breeden, Y. Cho, C. Ahles, J. Choi, and A. C. Kummel, UCSD

  40. Formation of Electronically And Chemically Passive Termination on PbSe Quantum Dot Superlattices (poster), S. T. Ueda, I. Kwak, A. Abelson, S. Wolf, C. Qian, M. Law, and A. C. Kummel, UCSD, UC Irvine

  41. DFT models of ferroelectric-paraelectric and ferroelectric-antiferroelectric boundaries in hafnium-zirconium oxides (talk), K. Chae, K. Cho, and A. C. Kummel, UCSD, UT Dallas


    42. 2020 IEEE Symposium on VLSI Technology Jun 16-19, 2020 (Honolulu, HI, USA, virtual) 1 talk
  42. Atomic-Scale Imaging of Polarization Switching in an (Anti-)Ferroelectric Memory Material: Zirconia (ZrO2) (talk) S Lombardo, C Nelson, K Chae, S Reyes-Lillo, M Tian, N Tasneem, Z Wang, M Hoffmann, D Triyoso, S Consiglio, K Tapily, R Clark, G Leusink, K Cho, A Kummel, J Kacher, A Khan


    43. Materials Research Society Annual Meeting April 13-17 2020 (Phoenix Az converted to virtual) (1 invited and 1 contributed talk)
  43. Nanoscale Proximity Effects in Selective Metal ALD (invited) Andrew Kummel, Michael Breeden, Steven Wolf, Ashay Anurag, Victor Wang

  44. DFT Models of Negative Capacitance in Hafnium/Zirconium Oxide Polymorphs Kisung Chae, Kyeongjae Cho, Andrew Kummel


    45. Very Large Scale Integration Conference VLSI-TSA April 27-29 2020 (Hsinchu, Taiwan converted to virtual) (2 contributed talks and 1 poster)
  45. Proximity Effect of Selective Co ALD on the Nanoscale, (poster) Michael Breeden, Steven Wolf, Ashay Anurag,Victor Wang, Andrew C. Kummel University of California, San Diego

  46. DFT Models of Negative Capacitance, (talk) Kisung Chae, Kyeongjae Cho, Andrew Kummel UCSD UTD

  47. Deposition of High Thermal Conductivity AlN Heat Spreader Films (talk) Scott T. Ueda, Aaron McLeod1, Michelle Chen, Chris Perez, Eric Pop, Dan Alvarez, Andrew C. Kummel UCSD, Stanford, and Rasirc


    48. Atomic Layer Deposition Conference (ALD-2020AVS) June 28 to July 1 2020 (Ghent Belgium converted to Virtual) 1 invited talk
  48. Deposition of High Thermal Conductivity AlN Heat Spreader Films Andrew Kummel (University of California, San Diego, USA),


    49. ECS PRiME Conference Oct 4-9, 2020 (Virtual) 1 poster
  49. Deposition of Large-Grain Polycrystalline Aluminum Nitride at Low Temperature via Bias-Enhanced Atomic Layer Annealing Aaron J. McLeod, Scott T. Ueda, Andrew C. Kummel (Virtual conference)


    50. IEEE International Interconnect Technology Conference (IITC) Oct 5-8, 2020 (Ghent Belgium converted to Virtual) 1 contributed talk
  50. Proximity Effect of Selective Co ALD on the Nanoscale M. Breeden S Wolf, A. Anurag, V. Wang, D. Moser, R. Kanjolia, M. Moinpour, J. Woodruff, A. C. Kummel


    51. International Electron Device Meeting (IEDM) Dec 13-15 2020 (San Francisco converted to virtual) 1 contributed talk
  51. Sub-0.5 nm Interfacial Dielectric Enables Superior Electrostatics: 65 mV/dec Top-Gated Carbon Nanotube FETs at 15 nm Gate Length, G. Pitner; Z. Zhang; Q. Lin; S.-K Su; C. Gilardi; C. Kuo; H. Kashyap; T. Weiss; Z. Yu; T. -A. Chao; L.-J. Li; S, Mitra, H.-S. P. Wong, J. Cai, A. Kummel, P. Bandaru, M. Passlack


    52. Semiconductor Interface Specialist Conference, SISC, Dec 7-10 2020 (San Diego, CA converted to virtual). 3 contributed talks and 5 posters
  52. DFT models on interfaces of ferroelectric and antiferroelectric hafnium¬ zirconium oxides to dielectric oxides and semiconductor, (talk) K. Chae, A. C. Kummel, and K. J. Cho, UCSD, UT Dallas

  53. Precursor Comparison for Selective Low Resitivity Selective Ru Atomic Layer Deposition, (poster) V. Wang, M. Breeden, and A. C. Kummel, UCSD

  54. Selective Pulsed Chemical Vapor Deposition of TiO2/Al2O3 Nanolaminates on Si and SiO2 in Preference to SiCOH, (poster) J. Huang, Y. Cho, and A. C. Kummel UCSD

  55. Bias ¬Enhanced Atomic Layer Annealing for the Deposition of High ¬Quality Aluminum Nitride Thin Films On Silicon, (poster) A. J. McLeod, S. T. Ueda, and A. C. Kummel, UCSD

  56. Deposition Mechanism of Sub 1nm EOT Bilayer Gate Oxides on Inert Carbon Surfaces Via Lateral growth of Al2O3 Nucleation Layers, (talk) Z. Zhang, C. Kuo, J. Spiegelman, H. Kashyap, G. Pitner, M. Passlack, Q. Lin, H.¬S. P. Wong, A. C. Kummel, and P. Bandaru, UCSD, TSMC, Stanford U.

  57. Selective Pulsed CVD of HfO2/TiO2 Nanolaminate for Nanoscale Patterning, (talk) Y. Cho, J. Huang, C. Ahles, and A. C. Kummel, UCSD

  58. Ferroelectric HZO capacitor with W/TiN bottom electrode with no wakeup, (poster) H. Kashyap, M. S. Kavrik, C. Kuo, T. Weiss, A. Yadav, and A. C. Kummel, UCSD, Applied Materials

  59. Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition on Silicon, (poster) C. Kuo, V. Wang, Z. Chang, H. Kashyap, D. Alvarez, and A. C. Kummel, UCSD, RASIRC


    60. GOMACTech 2021 March 19-21 2021 (San Diego, CA converted to virtual)
  60. Bias-Enhanced Atomic Layer Annealing for the Deposition of High-Quality Aluminum Nitride Thin Films on Silicon (poster) A. McLeod, S. Ueda, A. Kummel


    61. Materials Research Society (MRS) National Meeting April 18-21 2021 (Arizona, AZ converted to virtual) 3 contributed talks
  61. In Situ Transmission Electron Microscopy of Field-Induced Polarization Switching in Antiferroelectric Zirconia (talk) Sarah Lombardo, Christopher Nelson, Kisung Chae, Sebastian E. Reyes-Lillo, Mengkun Tian, Nujhat Tasneem, Zheng Wang, Michael Hoffmann, Kyeongjae Cho, Andrew Kummel, Josh Kacher and Asif Khan

  62. Ferroelectric HZO Capacitor with W/TiN Bottom Electrode with No Wakeup (talk) Harshil Kashyap, Mahmut S. Kavrik, Chenghsuan Kuo, Ajay Yadav and Andrew Kummel; University of California, San Diego, United States; Applied Materials, Inc., United States

  63. DFT Modeling of Scaling Limits in FEFETs Kisung Chae, Andrew Kummel and Kyeongjae Cho University of California, San Diego, United States; The University of Texas at Dallas, United States


    64. Very Large Scale Integration Conference VLSI-TSA April 19-21 2021 (Hsinchu, Taiwan + hybrid) 1 invited talk + 2 contributed talks
  64. Back End of Line (BOEL) Processing and Cross Over to Packaging (invited short course) Andrew Kummel, University of California, San Diego

  65. Grain Structure – Resistivity Relationship of Ru ALD Precursor Michael Breeden, Victor Wang, Francis Yu, and Andrew C. Kummel University of California, San Diego

  66. DFT Models of Ferroelectric Hafnium-Zirconium Oxide Stacks With and Without Dielectric Interlayer Kisung Chae, Andrew Kummel, Kyeongjae Cho UCSD and UT Dallas


    67. ALD/ALE 2021 June 27-30 (Virtual) 1 contributed talk
  67. Inherent Selective CVD of amorphous HfO2/TiO2 Nanolaminate for Nanoscale Patterning Y. Cho, J. Huang, C. Ahles, K. Wong, S. D. Nemani, E. Yieh, A. C. Kummel UCSD and Applied Materials


    68. International Interconnect Conference (IITC) July 6-9 2021 (Kyoto, Japan converted to virtual) 2 contributed talks
  68. Characterization of Low-Temperature Selective Cobalt Atomic Layer Deposition (ALD) for Chip Bonding M.-J. Liu, M. Breeden, V. Wang, N. N. J. Lin, C. H. Winter, A. Kummel, M. Bakir UCSD, Wayne State, Georgia Tech

  69. Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition on Silicon," C.-H. Kuo; V. Wang; Z. Zhang; J. Spiegelman; D. Alvarez; A. C. Kummel, S. Yun, H. Simka UCSD, Rasirc, Samsung


    70. 240th Meeting of The Electrochemical Society (ECS) Oct 10-14 2021 (Orlando, Florida converted to Virtual) 1 invited talk
  70. Deposition of Crystalline AlN on Si and SiC Using Atomic Layer Annealing and Pulsed ALD/CVD A. C. Kummel, S. Ueda, A. McLeod, D. Alvarez, J. Spiegelman, J. Woodruff, M. Moinpour, and R. Kanjolia UCSD, EMD Electronics, Rasirc


    71. American Vacuum Society National Meeting AVS Oct 25-Oct, 2021 (Tampa, F converted to virtual) -1 contributed talks
  71. Deposition of Large-Grained Polycrystalline Aluminum Nitride at Low Temperature via Bias-Enhanced Atomic Layer Annealing, Aaron McLeod, S. Ueda, A. Kummel, UC San Diego


    72. International Electron Devices Meeting (IEDM) Dec 1-5, 2021 (San Francisco, CA) 1 contributed talk
  72. Short-Channel Double-Gate FETs with Atomically Precise Graphene Nanoribbons” Z. Mutlu, Y. Lin, G. B. Barin, Z. Zhang, G. Pitner, S. Wang, R. Darawish, M. Di Giovannantonio, H. Wang, J.Cai, M. Passlack, C. H. Diaz, A. Narita, K. Müllen, F. R. Fischer, P. Bandaru, A. C. Kummel, P. Ruffieux, R. Fasel, and J. Bokor UCSD, UC Berkley TSMC, Stanford


    73. Semiconductor Interface Specialist Conference, SISC, Dec 7-10 2021 (San Diego, CA) 1 invited talk, 1 contributed talk + 6 posters
  73. Isovalent doping in hafnium¬zirconium oxides to lower polarization switching voltage (talk) K. Chae , A. C. Kummel, and K. Cho, UCSD and UT Dallas

  74. Selectivity Relationship of Ru ALD towards Bulk¬like Resistivity (poster), M. Breeden, V. Wang, F. Yu, R. Kanjolia, M. Moinpour J. Woodruff, H. Simka, and A. C. Kummel, UCSD,2EMD Electronics, Samsung Electronics

  75. Crystalline Gallium Nitride Deposition by RF ¬Biased Atomic Layer Annealing (poster), A. J. McLeod, S. T. Ueda, J. Spiegelman and A. C. Kummel, UCSD, RASIRC

  76. RF ¬Biased Atomic Layer Annealing of Polycrystalline Materials at Low Temperature on Insulators (invited talk), A. J. McLeod, S. T. Ueda, J. Spiegelman, and A. C. Kummel, UCSD, RASIRC

  77. Plasma Enhanced Atomic Layer Deposition of Crystallized Gallium Phosphide with Triethylgallium and Tritertbutylphosphine (poster), S. Yun, S. T. Ueda, V. Wang, C.¬H. Kuo, H. Kashyap, A. J. McLeod, and A. C. Kummel, UCSD

  78. Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition in Patterned Samples,(poster) C.¬H. Kuo, A. J. McLeod, J. Huang, V. Wang, Z. Chang, D. Alvarez, and A. C. Kummel UCSD, RASIRC

  79. Selective Chemical Vapor Deposition of TiO2/Al2O3 and HfO2/Al2O3 Nanolaminates on Si and SiO2 in Preference to SiCOH,(poster) J. Huang, Y. Cho, Z. Zhang, K. T. Wong, S. D. Nemani, E. Yieh, and A. C. Kummel UCSD, Applied Materials

  80. Interlayer thinning by Oxygen scavenging Electrode in HZO/Ge interface (poster), H. Kashyap and A. C. Kummel, UCSD

    81. Very Large Scale Integration Conference VLSI-TSA April 18-21 2022 (Hsinchu, Taiwan + hybrid) 1 poster
  81. Tetravalent doping in hafnium-zirconium oxides to lower polarization switching voltage (poster) Kisung Chae, Andrew C Kummel and Kyeongjae Cho


    82. Areas Selective Deposition Conference 2022 April 21-22 2022 (San Francisco, CA) 1 invited talk + 1 contributer tak + 4 posters
  82. Studies Toward Highly Selective Cobalt Metal ALD on Copper Features for Heterogeneous Chiplet Integration (talk) Z.J. Devereaux, M. Manle, M.J. Li, N.M.K. Linn, M.S. Bakir, A. Kummel, C.H. Winter UCSD, Wayne State, Georgia Tech

  83. Minimization of Hydrogen Plasma Damage J.J. Spiegelman, D. Alvarez, J.Z. Spiegelman, Y. Cho, J. Wang, A.C. Kummel UCSD, Rasirc

  84. Role of Dose Optimization in Ru ALD for Low Resistivity Films (poster) V. Wang, M. Breeden, N. Ashburn, M. Bergschneider, J. Speigelman H. Simka, K. Cho, A. Kummel USD, Rasirc, UT Dallas

  85. Selective Water-Free Chemical Vapor Deposition of HfO2/TiO2 nanolaminate for nanoscale patterning (poster) Y. Cho, H. Huang, C. Ahles, K. Wong, S.D. Nemani, E. Yieh, A. Kummel UCSD, Applied Materials

  86. Pulsed CVD of TiO2/Al2O3 and HfO2/Al2O3 Nanolaminates on Si and SiO2 in Preference to SiCOH (invited) A. Kummel


    87. Materials Research Society (MRS) April 2-5 2022 (Hawaii) 1 invited talk + 2 poster contributed talks
  87. Extreme Density Fused Al2O3 Microdiamond-TMPTA Composites for Interposer and Advanced Packaging for RF/mmWave Applications (poster) Chelsea Swank, Michelle Chen, Woojae Lee, Andrew Kummel and Eric Pop UCSD, Stanford

  88. Reduced Polarization Switching Energy Barrier in Tetravalent-Doped HfO2, (poster) Kisung Chae, Andrew Kummel, Kyeongjae Cho

  89. Control of Interfacial Gain Structure for Deposition of III-V Nitrides with RF Bias Atomic Layer Annealing (invited) Aaron J. McLeod, Scott T. Ueda, Jeff Spiegelman, and Andrew C. Kummel UCSD and Rasirc

  90. Thermal and electrical Properties of Wide Bandgap Nitride thin films Deposited at Low Temperatures for Heterogenous Integration (contributed) M. Chen, C. Perez, V. Chen, Z. Sobell, C. Koroglu, I. Khan, S. Ueda, A. McLeod, E. Pop, K. Goodson, S. George, A. Kummel


    91. International Interconnect Conference (IITC) June 28-30 2022 (San Jose, CA) 1 invited talk, 1 poster
  91. ALD of Ru with bulk-like resistivity by balancing precursor concentration to maximum surface mobility and minimize contaminants (invited) Andrew Kummel

  92. Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition with TiCl4 and Metal-Organic Precursors in Horizontal Vias (poster) Cheng Hsuan Kuo, Andrew Kummel UCSD